Quectel’s FGH200M Wi-Fi HaLow Module, Built on Morse Micro’s MM8108, Now FCC/IC/CE/RCM Certified for Mass Production
Sydney, Australia – 30 July 2026 – Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced that Quectel’s FGH200M module has passed FCC/IC/CE/RCM certification. Built on Morse Micro’s MM8108 system-on-chip, the module is now cleared for mass-market production, giving IoT device makers a validated path to Wi-Fi HaLow at scale. The FGH200M, built […]
Morse Micro Welcomes CA Engineering to Wi-Fi HaLow Design Partner Program
Sydney, Australia — 7 July, 2026 — Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced that CA Engineering has joined its Design Partner Program. The partnership brings one of North America’s most experienced wireless design houses into Morse Micro’s growing global ecosystem for production-ready Wi-Fi HaLow solutions. The Design Partner Program formalizes […]
Morse Micro Wins 2026 Pinnacle Award for Advancing Edge AI Connectivity
Artificial intelligence is rapidly moving beyond the cloud. Today, cameras, sensors, smart meters, industrial equipment, and building systems are increasingly processing data and making decisions at the edge. As this transformation accelerates, one challenge has become clear: Edge AI is only as effective as the connectivity that supports it. We’re proud to announce that Morse […]
